The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Nov. 07, 2017
Applicant:

Tektronix, Inc., Beaverton, OR (US);

Inventors:

Julie A. Campbell, Beaverton, OR (US);

William A. Hagerup, Portland, OR (US);

Ira G. Pollock, Hillsboro, OR (US);

Christina D. Enns, Beaverton, OR (US);

James E. Spinar, Clackamas, OR (US);

Kathleen F. M. Ullom, West Linn, OR (US);

Charles M. Hartmann, Forest Grove, OR (US);

Daniel J. Ayres, Warren, OR (US);

Assignee:

Tektronix, Inc., Beaverton, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01R 1/067 (2006.01); H01R 13/24 (2006.01); C12Q 1/00 (2006.01); G01R 1/073 (2006.01); G05G 1/00 (2006.01); H01R 101/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06722 (2013.01); G01R 1/06733 (2013.01); G01R 1/06766 (2013.01); G01R 1/06772 (2013.01); G01R 1/06788 (2013.01); H01R 13/2421 (2013.01); C12Q 1/00 (2013.01); G01R 1/073 (2013.01); G05G 1/00 (2013.01); H01L 21/00 (2013.01); H01L 2221/00 (2013.01); H01R 2101/00 (2013.01); H01R 2201/20 (2013.01);
Abstract

A test probe tip can include a resistive element coupled with a tip component. The resistive element can include a resistive layer disposed on an exterior surface of a structural member of the resistive impedance element. In embodiments, the resistive element can be configured to form a structural component of the test probe tip without an insulating covering applied thereto. Additional embodiments may be described and/or claimed herein.


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