The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Aug. 10, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Paul Van Valkenburg, Whitefish, MT (US);

Robert Mikkola, Kalispell, MT (US);

John L. Klocke, Proctor, MT (US);

Paul R. McHugh, Kalispell, MT (US);

Gregory J. Wilson, Kalispell, MT (US);

Kyle Moran Hanson, Kalispell, MT (US);

Eric J. Bergman, Kalispell, MT (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); C25D 21/10 (2006.01); C25D 17/06 (2006.01);
U.S. Cl.
CPC ...
C25D 21/10 (2013.01); C25D 5/02 (2013.01); C25D 7/12 (2013.01); C25D 17/001 (2013.01); C25D 17/06 (2013.01); C25D 17/002 (2013.01); C25D 17/008 (2013.01);
Abstract

In electroplating apparatus, a paddle or agitator agitates electrolyte in a vessel to provide high velocity fluid flow at the surface of a wafer. The agitator is designed and/or moved to also selectively shield part of the wafer, for example the edge of the wafer, from the electric field in the vessel. Selectively shielding may be achieved by temporally shifting the average position of the agitator towards one side of the wafer, by omitting or shortening slots in the agitator, and/or by synchronizing movement of the agitator with rotation of the wafer.


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