The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

May. 27, 2015
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Zengbiao Huang, Guangdong, CN;

Huayang Deng, Guangdong, CN;

Yongjing Xu, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C08G 59/40 (2006.01); C08K 9/00 (2006.01); C08G 59/50 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C08G 59/22 (2006.01); C08G 59/66 (2006.01); C01B 13/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/223 (2013.01); C08G 59/504 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C01B 13/00 (2013.01);
Abstract

The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.


Find Patent Forward Citations

Loading…