The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Jan. 11, 2017
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Tohru Kawai, Ibaraki, JP;

Yasutaka Nakashiba, Ibaraki, JP;

Yutaka Akiyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 27/06 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 27/07 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7813 (2013.01); H01L 23/4952 (2013.01); H01L 23/49562 (2013.01); H01L 23/5223 (2013.01); H01L 27/0629 (2013.01); H01L 27/0733 (2013.01); H01L 29/0696 (2013.01); H01L 29/1095 (2013.01); H01L 29/4236 (2013.01); H01L 29/66333 (2013.01); H01L 29/66348 (2013.01); H01L 29/66712 (2013.01); H01L 29/66734 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01); H01L 29/7803 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01);
Abstract

Performance of a semiconductor device is improved without increasing an area size of a semiconductor chip. For example, a source electrode of a power transistor and an upper electrode of a capacitor element have an overlapping portion. In other word, the upper electrode of the capacitor element is formed over the source electrode of the power transistor through a capacitor insulating film. That is, the power transistor and the capacitor element are arranged in a laminated manner in a thickness direction of the semiconductor chip. As a result, it becomes possible to add a capacitor element to be electrically coupled to the power transistor while suppressing an increase in planar size of the semiconductor chip.


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