The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Jun. 26, 2015
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Takeshi Kawabata, Shizuoka-ken, JP;

Hiroo Takizawa, Shizuoka-ken, JP;

Akinori Shibuya, Shizuoka-ken, JP;

Akiyoshi Goto, Shizuoka-ken, JP;

Masafumi Kojima, Shizuoka-ken, JP;

Keita Kato, Shizuoka-ken, JP;

Assignee:

FUJIFILM Corporation, Minato-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/039 (2006.01); C07D 217/06 (2006.01); C07D 333/48 (2006.01); C07D 333/46 (2006.01); C07D 333/76 (2006.01); C07D 335/02 (2006.01); C07D 295/185 (2006.01); C07D 327/06 (2006.01); C07C 309/12 (2006.01); C07C 309/29 (2006.01); C07C 309/17 (2006.01); C07C 309/06 (2006.01); C07C 311/48 (2006.01); C07C 317/04 (2006.01); C07C 381/12 (2006.01); C07J 9/00 (2006.01); C07J 17/00 (2006.01); C07J 31/00 (2006.01); G03F 7/038 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0045 (2013.01); C07C 309/06 (2013.01); C07C 309/12 (2013.01); C07C 309/17 (2013.01); C07C 309/29 (2013.01); C07C 311/48 (2013.01); C07C 317/04 (2013.01); C07C 381/12 (2013.01); C07D 217/06 (2013.01); C07D 295/185 (2013.01); C07D 327/06 (2013.01); C07D 333/46 (2013.01); C07D 333/48 (2013.01); C07D 333/76 (2013.01); C07D 335/02 (2013.01); C07J 9/005 (2013.01); C07J 17/00 (2013.01); C07J 31/006 (2013.01); G03F 7/0397 (2013.01); C07C 2601/14 (2017.05); C07C 2603/74 (2017.05); G03F 7/038 (2013.01); G03F 7/039 (2013.01);
Abstract

Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (A) and any of compounds (B) of general formula (I) below. (In general formula (I), Rf represents a fluorine atom or a monovalent organic group containing at least one fluorine atom; Rrepresents a hydrogen atom or a monovalent substituent containing no fluorine atom; Xrepresents a monovalent organic group having at least two carbon atoms, or a methyl group in which a substituent other than a fluorine atom is optionally introduced, provided that Xmay be bonded to Rto thereby form a ring; and Z represents a moiety that when exposed to actinic rays or radiation, is converted to a sulfonic acid group, an imidic acid group or a methide acid group).


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