The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Feb. 06, 2018
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Darren Roger Frenette, Pakenham, CA;

George Khoury, Ottawa, CA;

Leslie Paul Wallis, Ottawa, CA;

Lori Ann DeOrio, Irvine, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01); H01L 23/52 (2006.01); H01L 23/535 (2006.01); H05K 1/18 (2006.01); H03F 3/195 (2006.01); H03F 3/213 (2006.01); H03H 7/06 (2006.01); H01L 25/18 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H04B 1/40 (2015.01); H01L 25/16 (2006.01); H01L 41/047 (2006.01); H01L 41/113 (2006.01); H03B 5/32 (2006.01); H03H 1/00 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/3107 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 41/0475 (2013.01); H01L 41/113 (2013.01); H03B 5/32 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H03H 7/06 (2013.01); H04B 1/40 (2013.01); H01L 2223/6644 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/146 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H03F 2200/451 (2013.01); H03H 9/0547 (2013.01); H03H 2001/0021 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10674 (2013.01);
Abstract

A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.


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