The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

May. 23, 2014
Applicant:

GE Embedded Electronics Oy, Helsinki, FI;

Inventors:

Petteri Palm, Helsinki, FI;

Tuomas Waris, Helsinki, FI;

Antti Iihola, Helsinki, FI;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 1/14 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 23/49833 (2013.01); H01L 23/5381 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H01L 23/5389 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/24195 (2013.01); H01L 2924/01029 (2013.01); H05K 1/14 (2013.01); H05K 3/207 (2013.01); H05K 2201/10363 (2013.01);
Abstract

The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.


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