The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Jan. 15, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jin-hee Kang, Yongin-si, KR;
Ji-hoon Kang, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 33/60 (2010.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/0079 (2013.01); H01L 33/0095 (2013.01); H01L 33/32 (2013.01); H01L 33/502 (2013.01); H01L 33/507 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 25/50 (2013.01);
Abstract
A method for manufacturing a light emitting diode (LED) apparatus is provided. The method includes forming a plurality of color filters on a glass layer, forming a plurality of light leakage preventing films on the glass layer in a space between the plurality of color filters; forming a plurality of conductive materials on a surface of each of the plurality of light leakage preventing films opposite to the glass layer; and bonding a plurality of light emitting diodes with the plurality of conductive materials to correspond to the plurality of color filters, respectively.