The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Oct. 01, 2016
Intel Corporation, Santa Clara, CA (US);
Vasudevan Srinivasan, Hillsboro, OR (US);
Daniel G. Borkowski, Lunenburg, MA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing late fusing of processor features using a non-volatile memory. For instance, there is disclosed in accordance with one embodiment a functional semiconductor package, including: a processor core configurable via a plurality of configuration registers; a non-volatile storage, in which a first portion of the non-volatile storage includes permanently lockable storage that once written cannot be overwritten or modified, and in which a second portion of the non-volatile storage includes the plurality of configuration registers; a first write interface to the non-volatile storage, in which the permanently lockable storage of the non-volatile storage is wirelessly writable externally from the functional semiconductor package via the first write interface; a second write interface to the non-volatile storage through which the plurality of configuration registers are writable; configuration data for the processor core written wirelessly into the permanently lockable storage of the non-volatile storage; and in which the configuration data is distributed into the plurality of configuration registers via the second write interface at every boot of the functional semiconductor package. Other related embodiments are disclosed.