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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10229827 B1

PDFFull Text
Date of Patent:
Mar. 12, 2019

Filed:

Dec. 18, 2017

Method of redistribution layer formation for advanced packaging applications

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Han-Wen Chen, Cupertino, CA (US);

Steven Verhaverbeke, San Francisco, CA (US);

Roman Gouk, San Jose, CA (US);

Guan Huei See, Singapore, SG;

Yu Gu, Singapore, SG;

Arvind Sundarrajan, Singapore, SG;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:

Patterson + Sheridan LLP

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/02 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/311 (2006.01); G03F 7/00 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02107 (2013.01); G03F 7/0002 (2013.01); H01L 21/0274 (2013.01); H01L 21/311 (2013.01); H01L 21/4825 (2013.01); H01L 23/5389 (2013.01);
Abstract

Embodiments of the present disclosure generally describe methods of forming one or more device terminal redistribution layers using imprint lithography. The methods disclosed herein enable the formation of high aspect ratio interconnect structures at lower costs than conventional photolithography and etch processes. Further, the processes and methods described herein desirably remove, reduce, and/or substantially eliminate voids in the surrounding polymer layer formed during the polymer deposition process or subsequent thereto.

Find Patent Forward Citations

Chen, Han-Wen. (2019). Method of redistribution layer formation for advanced packaging applications (U.S. Patent No. 10229827). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10229827

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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