The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Jul. 12, 2016
Applicants:

SK Innovation Co., Ltd., Seoul, KR;

SK Global Chemical Co., Ltd., Seoul, KR;

Inventors:

Min Ho Jung, Daejeon, KR;

Yu Na Shim, Daejeon, KR;

Kyun Phyo Lee, Daejeon, KR;

Jin Su Ham, Daejeon, KR;

Soo Young Hwang, Daejeon, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/09 (2006.01); G03F 7/32 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01); C08G 65/40 (2006.01); C08G 65/48 (2006.01); C09D 171/08 (2006.01);
U.S. Cl.
CPC ...
C08G 65/4012 (2013.01); C08G 65/48 (2013.01); C09D 171/08 (2013.01); G03F 7/091 (2013.01); G03F 7/094 (2013.01); G03F 7/322 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); C08G 2650/40 (2013.01);
Abstract

Provided are a polymer used for a manufacturing process of a semiconductor and a display, a resist underlayer film composition containing the polymer for a manufacturing process of a semiconductor and a display, and a method for manufacturing semiconductor device using the composition, and more specifically, the polymer of the present disclosure simultaneously has optimized etching selectivity and planarization characteristics, such that the resist underlayer film composition containing the polymer is usable as a hard mask for a multilayer semiconductor lithography process.


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