The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Sep. 26, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Kevin J. Lee, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 25/00 (2006.01); H01L 49/02 (2006.01); H01L 23/14 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 23/481 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 23/5228 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 25/50 (2013.01); H01L 28/40 (2013.01); H01L 23/145 (2013.01); H01L 23/525 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Embodiments of the present disclosure are directed towards an integrated circuit (IC) die. In embodiments, the IC die may include a semiconductor substrate, a plurality of active components disposed on a first side of the semiconductor substrate, and a plurality of passive components disposed on a second side of the semiconductor substrate. In embodiments the second side may be disposed opposite the first side. The passive components may, in some embodiments, include capacitors and/or resistors while the active components may, in some embodiments, include transistors. Other embodiments may be described and/or claimed.