The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Oct. 19, 2017
Applicant:

Power Integrations, Inc., San Jose, CA (US);

Inventors:

David Kung, Foster City, CA (US);

David Michael Hugh Matthews, Los Gatos, CA (US);

Balu Balakrishnan, Saratoga, CA (US);

Assignee:

Power Integrations, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01); H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H04B 15/00 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 27/02 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/3114 (2013.01); H01L 23/48 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/5227 (2013.01); H01L 27/0248 (2013.01); H01L 28/10 (2013.01); H04B 15/005 (2013.01); H05K 7/14 (2013.01); H01L 24/48 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/00014 (2013.01);
Abstract

An integrated circuit package includes a portion of a lead frame disposed within an encapsulation. The lead frame includes a first conductor including a first conductive loop and a third conductive loop disposed substantially within the encapsulation. A second conductor formed in the lead frame is galvanically isolated from the first conductor and includes a second conductive loop disposed substantially within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors. The third conductive loop is wound in an opposite direction relative to the first conductive loop. A transmit circuit is disposed within the encapsulation and is coupled to the second conductor to provide a transmitter current. A receive circuit is disposed within the encapsulation and is coupled to the first conductor to receive a transmitter induced signal in response to the transmitter current.


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