The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Feb. 02, 2017
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Jason Daejin Park, Lake Oswego, OR (US);

Bart van Schravendijk, Sunnyvale, CA (US);

Hsiang-yun Lee, Cupertino, CA (US);

Purushottam Kumar, Hillsboro, OR (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02211 (2013.01); H01L 21/02266 (2013.01); H01L 21/02274 (2013.01); H01L 21/02315 (2013.01); H01L 23/485 (2013.01);
Abstract

A method for processing a substrate to create an air gap includes a) providing a substrate including a first trench and a second trench; b) depositing a conformal layer on the substrate; c) performing sputtering to at least partially pinch off an upper portion of the first trench and the second trench at a location spaced from upper openings of the first trench and the second trench; and d) performing sputtering/deposition to seal first and second airgaps in the first trench and the second trench.


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