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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10224230 B1

PDFFull Text
Date of Patent:
Mar. 05, 2019

Filed:

Oct. 21, 2015

Surface protective sheet

Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Kazuyuki Tamura, Tokyo, JP;

Shigeto Okuji, Tokyo, JP;

Assignee:

LINTEC Corporation, Tokyo, JP;

Attorney:

Cahn & Samuels, LLP

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 27/00 (2006.01); B32B 27/18 (2006.01); H01L 21/304 (2006.01); C09J 7/29 (2018.01); C09J 7/20 (2018.01); C09J 7/38 (2018.01); G06K 19/077 (2006.01); C09J 7/25 (2018.01); B32B 7/04 (2019.01); B32B 25/08 (2006.01); B32B 25/14 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 7/04 (2013.01); B32B 25/08 (2013.01); B32B 25/14 (2013.01); B32B 27/00 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/304 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); C09J 7/20 (2018.01); C09J 7/25 (2018.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); G06K 19/077 (2013.01); H01L 21/304 (2013.01); H01L 21/683 (2013.01); H01L 21/6836 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/10 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2264/105 (2013.01); B32B 2307/202 (2013.01); B32B 2307/21 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/50 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2457/14 (2013.01); C08K 2201/001 (2013.01); C09J 2201/602 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2463/006 (2013.01); C09J 2475/006 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa.

Find Patent Forward Citations

Tamura, Kazuyuki. (2019). Surface protective sheet (U.S. Patent No. 10224230). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10224230

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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