The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Sep. 13, 2016
Applicant:

Kemet Electronics Corporation, Simpsonville, SC (US);

Inventors:

Galen W. Miller, Simpsonville, SC (US);

John E. McConnell, Simpsonville, SC (US);

John Bultitude, Simpsonville, SC (US);

Garry L. Renner, Simpsonville, SC (US);

Assignee:

KEMET Electronics Corporation, Simpsonville, SC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/38 (2006.01); H01G 2/06 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/40 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01G 4/38 (2013.01); H01G 2/06 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); H01L 23/48 (2013.01); H01L 23/52 (2013.01); H05K 1/182 (2013.01);
Abstract

Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.


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