The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

May. 26, 2016
Applicants:

Ihi Corporation, Koto-ku, JP;

The University of Tokyo, Bunkyo-ku, JP;

Inventors:

Takeshi Nakamura, Tokyo, JP;

Masato Ishizaki, Tokyo, JP;

Kozue Hotozuka, Tokyo, JP;

Yasuyuki Fukushima, Tokyo, JP;

Yukihiro Shimogaki, Tokyo, JP;

Takeshi Momose, Tokyo, JP;

Hidetoshi Sugiura, Tokyo, JP;

Kohei Shima, Tokyo, JP;

Yuichi Funato, Tokyo, JP;

Assignees:

IHI CORPORATION, Koto-ku, JP;

THE UNIVERSITY OF TOKYO, Bunkyo-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/565 (2006.01); C04B 35/80 (2006.01); C04B 41/45 (2006.01); C04B 41/50 (2006.01); C04B 41/87 (2006.01); C23C 16/04 (2006.01); C23C 16/32 (2006.01); C23C 16/448 (2006.01); C04B 41/00 (2006.01);
U.S. Cl.
CPC ...
C04B 41/4531 (2013.01); C04B 35/565 (2013.01); C04B 35/806 (2013.01); C04B 41/009 (2013.01); C04B 41/457 (2013.01); C04B 41/4584 (2013.01); C04B 41/5059 (2013.01); C04B 41/87 (2013.01); C23C 16/045 (2013.01); C23C 16/325 (2013.01); C23C 16/4488 (2013.01); C04B 2235/5244 (2013.01); C04B 2235/5248 (2013.01); C04B 2235/5252 (2013.01); C04B 2235/5256 (2013.01); C04B 2235/614 (2013.01);
Abstract

A mixed gas containing a precursor gas, an additive gas and a carrier gas is supplied to a preform stored in an electric furnace, and silicon carbide is deposited by chemical vapor deposition or chemical vapor phase impregnation to form a film. The preform includes multiple fiber bundles, and the fiber bundles include multiple fibers. This heat-resistant composite material includes a ceramic fiber preform impregnated with silicon carbide, and producing the composite material involves a step in which silicon carbide is deposited between the fibers to integrate the fibers which configure the fiber bundles, and a step in which silicon carbide is deposited between the fiber bundles to integrate the fiber bundles. Hereby, uniformity of embedding and growth rate of the silicon carbide film are both attained.


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