The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Oct. 05, 2016
Applicant:
Atotech Deutschland Gmbh, Berlin, DE;
Inventors:
Christian Sparing, Berlin, DE;
Thomas Huelsmann, Berlin, DE;
Arno Clicque, Berlin, DE;
Patrick Brooks, Berlin, DE;
Adrian Zee, Berlin, DE;
Heiko Brunner, Berlin, DE;
Assignee:
Atotech Deutschland GmbH, Berlin, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 22/48 (2006.01); C23F 1/18 (2006.01); H05K 3/38 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/383 (2013.01); C23F 1/18 (2013.01); H05K 3/00 (2013.01); H05K 2203/124 (2013.01);
Abstract
A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I), wherein: