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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10219383 B1

PDFFull Text
Date of Patent:
Feb. 26, 2019

Filed:

Mar. 19, 2018

Printed wiring board and method for manufacturing the same

Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Katsutoshi Kitagawa, Ogaki, JP;

Takema Adachi, Ogaki, JP;

Assignee:

IBIDEN CO. , LTD., Ogaki, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 27/14636 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H05K 3/0032 (2013.01); H05K 3/108 (2013.01); H05K 3/184 (2013.01); H05K 3/188 (2013.01); H05K 3/424 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H01L 27/14634 (2013.01); H05K 2201/096 (2013.01); H05K 2201/0949 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01); H05K 2203/0554 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/107 (2013.01);
Abstract

A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.

Find Patent Forward Citations

Kitagawa, Katsutoshi. (2019). Printed wiring board and method for manufacturing the same (U.S. Patent No. 10219383). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10219383

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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