The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Apr. 01, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Do Jae Yoo, Suwon-Si, KR;
Jae Hyun Lim, Suwon-Si, KR;
Kyu Hwan Oh, Suwon-Si, KR;
Jong In Ryu, Suwon-Si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 3/4007 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H05K 1/111 (2013.01); H05K 3/28 (2013.01); H05K 3/3436 (2013.01); H05K 2201/09436 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/2072 (2013.01);
Abstract
An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.