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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10219369 B1

PDFFull Text
Date of Patent:
Feb. 26, 2019

Filed:

Jun. 20, 2017

Circuit board

Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventor:

Tatsuaki Denda, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Ishwarbhai B Patel

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 3/36 (2006.01); H05K 1/18 (2006.01); H05K 3/06 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/115 (2013.01); H05K 1/147 (2013.01); H05K 3/361 (2013.01); H05K 3/423 (2013.01); H05K 3/429 (2013.01); H05K 3/4623 (2013.01); H05K 3/4691 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 3/0064 (2013.01); H05K 3/06 (2013.01); H05K 3/4644 (2013.01); H05K 2201/068 (2013.01);
Abstract

A circuit board includes a rigid board including a first wiring layer formed on its upper surface side, and a flexible board including a base material having flexibility and disposed on an upper surface side of the first wiring layer, a second wiring layer formed on the base material, and a via wiring formed in a through-hole passing through the second wiring layer and the base material. The via wiring has a protrusion protruding from an upper surface of the second wiring layer, and extending on the upper surface of the second wiring layer positioned on an outer circumferential side of the through-hole.

Find Patent Forward Citations

Denda, Tatsuaki. (2019). Circuit board (U.S. Patent No. 10219369). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10219369

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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