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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10217727 B1

PDFFull Text
Date of Patent:
Feb. 26, 2019

Filed:

Aug. 25, 2014

Semiconductor device and electronic apparatus including a first semiconductor chip including an insulated gate bipolar transistor and a second semiconductor chip including a diode

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Akira Muto, Tokyo, JP;

Norio Kido, Tokyo, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Tokyo, JP;

Attorney:

McGinn I.P. Law Group, PLLC

Primary Examiner:

Bilkis Jahan

Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/28 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H02P 27/06 (2006.01); H02P 25/092 (2016.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/28 (2013.01); H01L 23/3114 (2013.01); H01L 23/498 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H02P 25/092 (2016.02); H02P 27/06 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/8485 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01);
Abstract

For example, a semiconductor device capable of achieving a high performance applicable to an SR motor is provided. The semiconductor device includes a chip mounting portion TABon which a semiconductor chip CHPhaving an IGBT is mounted, and a chip mounting portion TABon which a semiconductor chip CHPhaving a diode is formed. The semiconductor device also includes a lead LDA electrically connected to an emitter electrode pad EP of the semiconductor chip CHPvia a clip CLP, and a lead LDB electrically connected to an anode electrode pad ADP of the semiconductor chip CHPvia a clip CLP. At this time, the chip mounting portion TABis separated electrically from the chip mounting portion TAB, and the clip CLPis separated electrically from the clip CLP

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