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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10215512 B1

PDFFull Text
Date of Patent:
Feb. 26, 2019

Filed:

May. 13, 2015

Heat spreader and method for manufacturing the same

Applicant:

A.l.m.t. Corp., Tokyo, JP;

Inventors:

Hiroaki Oki, Sakata, JP;

Tadashi Arikawa, Toyama, JP;

Shouichi Inaba, Sakata, JP;

Assignee:

A.L.M.T. Corp., Tokyo, JP;

Attorneys:

Venable LLP

Michael A. Sartori

Laura G. Remus

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B32B 15/20 (2006.01); F28F 21/08 (2006.01); B32B 15/01 (2006.01); H01L 23/373 (2006.01); B32B 3/26 (2006.01); B32B 37/10 (2006.01); F28F 13/00 (2006.01); B22F 3/10 (2006.01); B22F 7/06 (2006.01); C22C 9/00 (2006.01); C22C 27/04 (2006.01);
U.S. Cl.
CPC ...
F28F 21/085 (2013.01); B32B 3/263 (2013.01); B32B 15/01 (2013.01); B32B 15/20 (2013.01); B32B 37/10 (2013.01); F28F 13/00 (2013.01); F28F 21/081 (2013.01); H01L 23/373 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); B22F 3/10 (2013.01); B22F 7/06 (2013.01); B32B 2250/03 (2013.01); B32B 2307/302 (2013.01); B32B 2311/12 (2013.01); B32B 2457/14 (2013.01); C22C 9/00 (2013.01); C22C 27/04 (2013.01); H01L 2924/0002 (2013.01);
Abstract

[Problem] To provide a heat spreader capable of removing heat from an element more efficiently and immediately than an existing one, and also capable of satisfactorily responding to further enhancement in performance and output of various apparatuses, and a method for efficiently manufacturing the same. [Solution] A heat spreader includes a Cu—Mo layer made of a Cu—Mo composite material and having an average thickness of less than or equal to 0.6 mm and a variation in thickness of less than or equal to 0.1 mm, and a Cu layer directly stacked on each of both surfaces thereof. A method for manufacturing the heat spreader includes planarizing a plate material of the Cu—Mo composite material constituting the Cu—Mo layer, and roll-bonding a Cu plate constituting the Cu layer to each of both surfaces thereof.

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