The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Apr. 20, 2018
Applicant:

Bostik, Inc., Wauwatosa, WI (US);

Inventors:

Baoyu Wang, Waukesha, WI (US);

Kelley Gerschke, Brookfield, WI (US);

Terhi I. Hawkins, Milwaukee, WI (US);

Charley Paul, Brown Deer, WI (US);

Kimberly E. Secrist, Wauwatosa, WI (US);

Assignee:

Bostik Inc., Wauwatosa, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/06 (2006.01); C09J 123/14 (2006.01); B32B 27/32 (2006.01); B32B 5/02 (2006.01); B32B 27/12 (2006.01); C08L 23/14 (2006.01); B32B 5/04 (2006.01); B32B 5/26 (2006.01); B32B 7/12 (2006.01); B32B 3/04 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
C09J 123/142 (2013.01); B32B 3/04 (2013.01); B32B 5/022 (2013.01); B32B 5/04 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 27/12 (2013.01); B32B 27/32 (2013.01); B32B 37/1207 (2013.01); C08L 23/142 (2013.01); C09J 11/06 (2013.01); B32B 2037/1215 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2255/02 (2013.01); B32B 2255/26 (2013.01); B32B 2305/18 (2013.01); B32B 2307/308 (2013.01); B32B 2307/50 (2013.01); B32B 2307/51 (2013.01); B32B 2307/54 (2013.01); B32B 2307/542 (2013.01); B32B 2307/546 (2013.01); B32B 2307/548 (2013.01); B32B 2307/558 (2013.01); B32B 2307/58 (2013.01); B32B 2307/702 (2013.01); B32B 2307/704 (2013.01); B32B 2307/718 (2013.01); B32B 2307/72 (2013.01); B32B 2323/04 (2013.01); B32B 2437/00 (2013.01); B32B 2519/00 (2013.01); B32B 2535/00 (2013.01); B32B 2553/00 (2013.01); B32B 2555/02 (2013.01); B32B 2581/00 (2013.01); C08L 2314/06 (2013.01);
Abstract

A method for making a laminate comprises the steps of applying a hot melt adhesive composition in a molten state to a primary substrate and mating a secondary substrate to the first substrate by contacting the secondary substrate with the adhesive composition. The composition comprises a polymer blend based on a low molecular weight semicrystalline propylene based polymer and a high molecular weight essentially amorphous propylene based polymer, both of which are prepared by using single-site catalysts. The composition further contains a compatible tackifier, a plasticizer, an antioxidant, and optionally a wax, a filler, a colorant, a UV absorber, another polymer, or combinations thereof. Particularly preferred applications include nonwoven disposable diaper and feminine sanitary napkin construction, diaper and adult incontinent brief elastic attachment, diaper and napkin core stabilization, diaper backsheet lamination, industrial filter material conversion, and surgical gown and surgical drape assemblies.


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