The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Nov. 28, 2016
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Shunsaku Yoshikawa, Tokyo, JP;
Hikaru Nomura, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 13/00 (2006.01); B23K 35/26 (2006.01); C22C 13/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01);
Abstract
A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1 to 0.8%; Ag: 0 to 0.3%; Cu: 0 to 0.7%; P: 0.001 to 0.1%, with the balance being Sn. A total amount of Ag and Bi is from 0.3 to 0.8% in the alloy composition.