The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Jul. 29, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Ning Tan, Allen, TX (US);

Weidong Tian, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/788 (2006.01); H01L 29/423 (2006.01); H01L 27/11521 (2017.01); H01L 21/266 (2006.01); H01L 21/28 (2006.01); H01L 21/8238 (2006.01); H01L 21/265 (2006.01); H01L 27/11524 (2017.01); H01L 27/11529 (2017.01); H01L 29/66 (2006.01); H01L 27/11539 (2017.01); H01L 27/11541 (2017.01); H01L 27/11543 (2017.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 27/11526 (2017.01); H01L 29/08 (2006.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 21/8234 (2006.01); H01L 27/105 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42324 (2013.01); H01L 21/266 (2013.01); H01L 21/26586 (2013.01); H01L 21/28008 (2013.01); H01L 21/28273 (2013.01); H01L 21/823412 (2013.01); H01L 21/823443 (2013.01); H01L 21/823814 (2013.01); H01L 23/528 (2013.01); H01L 23/53228 (2013.01); H01L 27/11521 (2013.01); H01L 27/11524 (2013.01); H01L 27/11526 (2013.01); H01L 27/11529 (2013.01); H01L 27/11539 (2013.01); H01L 27/11541 (2013.01); H01L 27/11543 (2013.01); H01L 29/0847 (2013.01); H01L 29/42328 (2013.01); H01L 29/45 (2013.01); H01L 29/495 (2013.01); H01L 29/4916 (2013.01); H01L 29/4966 (2013.01); H01L 29/513 (2013.01); H01L 29/518 (2013.01); H01L 29/66825 (2013.01); H01L 29/788 (2013.01); H01L 21/823456 (2013.01); H01L 27/1052 (2013.01); H01L 29/665 (2013.01); H01L 29/6659 (2013.01);
Abstract

An integrated circuit contains a flash cell in which the top gate of the sense transistor is a metal sense gate over the floating gate. The source/drain regions of the sense transistor extend under the floating gate so that the source region is separated from the drain region by a sense channel length less than 200 nanometers. The floating gate is at least 400 nanometers wide, so the source/drain regions of the sense transistor extend under the floating gate at least 100 nanometers on each side. The integrated circuit is formed by forming the sense transistor source and drain regions before forming the floating gate.


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