The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

May. 24, 2016
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Yasuhiko Kusama, Nagano, JP;

Hironobu Hashimoto, Nagano, JP;

Takeshi Chino, Nagano, JP;

Kazuhiro Kobayashi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H01L 23/31 (2006.01); H01L 23/50 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H05K 1/115 (2013.01); H05K 3/429 (2013.01); H05K 3/4697 (2013.01); H05K 2201/096 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01);
Abstract

An electronic component built-in substrate includes an insulating base material having a first surface and a second surface opposite to the first surface, an electronic component embedded in the insulating base material and having an electrode on a side surface thereof, a first wiring layer embedded in an area outside the electrode of the electronic component in the insulating base material with a surface of the first wiring layer being exposed from the first surface of the insulating base material, a via conductor reaching from the second surface of the insulating base material to a side surface of the electrode of the electronic component and the first wiring layer, and a second wiring layer formed on the second surface of the insulating base material and connected to the via conductor.


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