The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Sep. 22, 2017
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventors:
Bryan L. Buckalew, Tualatin, OR (US);
Stephen J. Banik, II, Portland, OR (US);
Joseph Richardson, Sherwood, OR (US);
Thomas A. Ponnuswamy, Sherwood, OR (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/027 (2006.01); H01L 23/532 (2006.01); H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0273 (2013.01); H01L 21/32051 (2013.01); H01L 21/7688 (2013.01); H01L 21/76873 (2013.01); H01L 21/76879 (2013.01); H01L 23/53228 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02335 (2013.01); H01L 2224/05647 (2013.01);
Abstract
Systems and methods for fabrication of a redistribution layer are described. There is no deposition of a seed layer, made from copper, on top of a substrate. The lack of the seed layer avoids a need for etching the seed layer. When the seed layer is not etched, the redistribution layer, also made from copper, is not etched.