The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Jun. 01, 2015
Applicant:
Shengyi Technology Co., Ltd., Dongguan, Guangdong, CN;
Inventors:
Assignee:
SHENGYI TECHNOLOGY CO., LTD., Dongguan, CN;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 59/06 (2006.01); C08G 59/42 (2006.01); C08G 59/32 (2006.01); C08G 73/10 (2006.01); C08L 63/00 (2006.01); C08L 79/00 (2006.01); C08K 3/013 (2018.01); C08K 3/36 (2006.01); C08K 5/00 (2006.01); C08K 5/11 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); B32B 27/04 (2006.01);
U.S. Cl.
CPC ...
C08G 59/063 (2013.01); C08G 59/3236 (2013.01); C08G 59/4215 (2013.01); C08G 73/1071 (2013.01); C08J 5/24 (2013.01); C08K 3/013 (2018.01); C08K 3/36 (2013.01); C08K 5/0025 (2013.01); C08K 5/0066 (2013.01); C08K 5/11 (2013.01); C08L 63/00 (2013.01); C08L 79/00 (2013.01); H05K 1/0373 (2013.01); B32B 27/04 (2013.01); C08J 2363/02 (2013.01); H05K 1/0326 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01);
Abstract
Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.