The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Aug. 20, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventor:

Hung Chih Chen, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/26 (2012.01); B24B 37/10 (2012.01); B24B 37/22 (2012.01); B24B 37/30 (2012.01); B24B 37/11 (2012.01); B24B 37/24 (2012.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 37/10 (2013.01); B24B 37/11 (2013.01); B24B 37/22 (2013.01); B24B 37/24 (2013.01); B24B 37/30 (2013.01); H01L 21/30625 (2013.01); H01L 21/31051 (2013.01); H01L 21/3212 (2013.01); H01L 21/32115 (2013.01); H01L 21/7684 (2013.01);
Abstract

A polishing pad includes and upper portion and one or more lower portions. The upper portion has an upper surface for attachment to a pad carrier and a first lateral dimension. The one or more lower portions project downward from the upper portion. A bottom surface of the one or more lower portions provide a contact surface to contact a substrate during chemical mechanical polishing. Each lower portion has a second lateral dimension that is less than the first lateral dimension. A total surface area of the contact surface from the one or more lower portions is no more than 10% of a surface area of the upper surface.


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