The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Jul. 08, 2016
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Wataru Odagiri, Tokyo, JP;

Taku Iwamoto, Tokyo, JP;

Kentaro Odanaka, Tokyo, JP;

Hironari Ohkubo, Tokyo, JP;

Shuichiro Tsukiji, Tokyo, JP;

Kouichi Nehashi, Tokyo, JP;

Joel Koerwer, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/03 (2006.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); B23K 26/36 (2014.01); B23K 26/402 (2014.01); H01L 21/67 (2006.01); H01L 21/78 (2006.01); H01L 21/26 (2006.01); B23K 26/364 (2014.01); H01L 21/268 (2006.01); H01L 21/82 (2006.01); B23K 103/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
B23K 26/032 (2013.01); B23K 26/364 (2015.10); B23K 26/402 (2013.01); H01L 21/2686 (2013.01); H01L 21/67092 (2013.01); H01L 21/82 (2013.01); B23K 2103/50 (2018.08); B23K 2103/56 (2018.08); H01L 22/12 (2013.01); H01L 22/26 (2013.01);
Abstract

A laser beam irradiation unit of laser processing apparatus includes a pulse laser beam oscillating unit, a condenser that condenses a pulse laser beam and emits the beam to a workpiece held by a chuck table, a dichroic mirror disposed between the pulse laser beam oscillating unit and the condenser, a strobe light irradiation unit that emits light to a path on which the dichroic mirror and the condenser are disposed, a beam splitter disposed between the strobe light irradiation unit and the dichroic mirror, and an imaging unit disposed on the path of light split by the beam splitter. A controller actuates the strobe light irradiation unit and the imaging unit according to the timing of the pulse laser beam, and detects the width of a laser-processed groove immediately after emission of the pulse laser beam on the basis of an image signal from the imaging unit.


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