The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Jan. 15, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Cheng-Wei Cheng, White Plains, NY (US);

Sanghoon Lee, White Plains, NY (US);

Effendi Leobandung, Stormville, NY (US);

Renee T. Mo, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/84 (2006.01); H01L 29/66 (2006.01); H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66795 (2013.01); H01L 21/02461 (2013.01); H01L 21/02463 (2013.01); H01L 21/02546 (2013.01); H01L 21/02598 (2013.01); H01L 21/3081 (2013.01); H01L 21/30612 (2013.01); H01L 21/31053 (2013.01); H01L 21/7624 (2013.01); H01L 29/66522 (2013.01);
Abstract

A method for use in forming a fin of a field-effect transistor includes: patterning a mandrel into a substrate at least by recessing portions of the substrate; forming dielectric material at least on the recessed portions of the substrate, wherein the dielectric material partially covers exterior sidewalls of the mandrel; forming a first buffer at least on a portion of the exterior sidewalls of the mandrel not covered by the dielectric material; forming a second buffer at least on exterior sidewalls of the first buffer; forming a semiconductor channel at least on the dielectric material, wherein at least the second buffer is between the channel and the mandrel; exposing interior sidewalls of at least the first buffer at least by removing the mandrel; and removing the first buffer and the second buffer without removing the channel.


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