The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Oct. 03, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Hyo Seok Woo, Hwaseong-si, KR;
Jang Gn Yun, Hwaseong-si, KR;
Joon Sung Lim, Yongin-si, KR;
Sung Min Hwang, Hwaseong-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 27/07 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H01L 29/43 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0738 (2013.01); H01L 21/31051 (2013.01); H01L 21/76895 (2013.01); H01L 24/06 (2013.01); H01L 28/24 (2013.01); H01L 29/435 (2013.01); H01L 29/4983 (2013.01);
Abstract
A semiconductor device is provided including a resistor structure on a semiconductor substrate. The resistor structure includes pad portions and a resistor body connecting the pad portions. The pad portions each have a width greater than a width of the resistor body. The pad portions each include a pad pattern and a liner pattern covering a sidewall and a lower surface of the pad pattern. The resistor body extends laterally from the liner pattern. The pad pattern includes a different material from the resistor body and the liner pattern.