The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Mar. 20, 2017
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Douglas M. Reber, Austin, TX (US);

Mehul D. Shroff, Austin, TX (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53276 (2013.01); H01L 21/28506 (2013.01); H01L 21/76802 (2013.01); H01L 21/76838 (2013.01); H01L 21/76852 (2013.01); H01L 21/76867 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/53209 (2013.01); H01L 23/53214 (2013.01); H01L 23/53266 (2013.01);
Abstract

A method for forming a semiconductor structure includes forming a first metal layer over a first dielectric layer, forming a first graphene layer on at least one major surface of the first metal layer, and forming a second dielectric layer over the first metal layer and the first graphene layer. The method further includes forming an opening in the second dielectric layer which exposes the first metal layer, forming a second metal layer over the second dielectric layer and within the opening, and forming a second graphene layer on at least one major surface of the second metal layer, wherein the second graphene layer is also formed within the opening.


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