The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Nov. 02, 2016
Applicant:
Rohinni, Llc., Coeur d' Alene, ID (US);
Inventors:
Andrew Huska, Liberty Lake, WA (US);
Orin Ozias, Austin, TX (US);
Cody Peterson, Hayden, ID (US);
Clinton Adams, Coeur d' Alene, ID (US);
Kasey Christie, Hayden, ID (US);
Assignee:
Rohinni, LLC, Coeur d'Alene, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G03G 15/043 (2006.01); H01L 33/56 (2010.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
G03G 15/043 (2013.01); H01L 21/67144 (2013.01); H01L 21/68 (2013.01); H01L 33/00 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A method of depositing an unpackaged semiconductor die ('die') onto a substrate. The method includes writing a latent image on a photosensitive drum. The latent image represents an outline for the die to be placed onto the substrate. The photosensitive drum is configured to have an electro-static charge and the die is transferred from the developing unit to the photosensitive drum so as to deposit the die onto the substrate according to the outline.