The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Feb. 23, 2017
Applicant:
Schaft Inc., Tokyo, JP;
Inventors:
Assignee:
Schaft Inc., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H02K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 1/09 (2006.01); H02K 11/33 (2016.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H02K 9/005 (2013.01); H02K 11/33 (2016.01); H05K 1/0204 (2013.01); H05K 1/09 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 1/05 (2013.01); H05K 2201/042 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10416 (2013.01);
Abstract
A system includes a primary Printed Circuit Board (PCB) and a heat transfer device that is attached to the primary PCB. The primary PCB includes a heat generating device and a thermal conductive inlay attached to the heat generating device. The heat transfer device includes a secondary PCB that is thermally coupled to the primary PCB, and a heat dissipation block. The heat dissipation block has a first side attached to the thermal conductive inlay of the primary PCB and a second side attached to the secondary PCB.