The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Sep. 29, 2016
Applicants:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Ningbo Semiconductor International Corporation, Ningbo, CN;

Inventors:

Herb He Huang, Shanghai, CN;

Clifford Ian Drowley, Shanghai, CN;

Hai Ting Li, Shanghai, CN;

Ji Guang Zhu, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66484 (2013.01); H01L 21/30625 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/76256 (2013.01); H01L 29/66742 (2013.01); H01L 29/78621 (2013.01); H01L 29/78648 (2013.01);
Abstract

The present disclosure provides a method for forming a transistor, including: forming a base structure, containing a first gate structure, an active layer covering the first gate structure, and an insulating structure in the active layer; forming a second gate structure on the active layer; forming a source-drain region, including a source region and a drain region in the active layer each on a different side of the second gate structure; and forming a first interlayer dielectric layer covering the base structure and the second gate structure. The method also includes: forming a first contact hole that exposes the first gate structure by etching the first interlayer dielectric layer and the insulating structure; and forming a second contact hole that exposes the second gate structure and a third contact hole that exposes the drain region by etching the first interlayer dielectric layer.


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