The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Oct. 25, 2016
Applicant:

Ningbo Sunny Opotech Co., Ltd., Ningbo, Zhejiang, CN;

Inventors:

Mingzhu Wang, Ningbo, CN;

Bojie Zhao, Ningbo, CN;

Zhenyu Chen, Ningbo, CN;

Takehiko Tanaka, Ningbo, CN;

Nan Guo, Ningbo, CN;

Zhen Huang, Ningbo, CN;

Duanliang Cheng, Ningbo, CN;

Liang Ding, Ningbo, CN;

Feifan Chen, Ningbo, CN;

Heng Jiang, Ningbo, CN;

Assignee:

Ningbo Sunny Opotech Co., Ltd., Ningbo, Zhejiang, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03B 17/56 (2006.01); G03B 17/12 (2006.01); G03B 17/02 (2006.01); H04N 5/225 (2006.01); F16M 11/10 (2006.01); F16M 11/04 (2006.01); F16M 13/00 (2006.01);
U.S. Cl.
CPC ...
G03B 17/12 (2013.01); G03B 17/02 (2013.01); H04N 5/2254 (2013.01); H04N 5/2258 (2013.01); F16M 11/04 (2013.01); F16M 11/041 (2013.01); F16M 11/10 (2013.01); F16M 13/00 (2013.01); G03B 17/56 (2013.01);
Abstract

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.


Find Patent Forward Citations

Wang, Mingzhu. (2019). Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device (U.S. Patent No. 10197890). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10197890

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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