The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Nov. 08, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Yves T. Ngu, Williston, VT (US);

Vibhor Jain, Essex Junction, VT (US);

John J. Ellis-Monaghan, Grand Isle, VT (US);

Sebastian Theodore Ventrone, South Burlington, VT (US);

Saurabh Sirohi, South Burlington, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/293 (2006.01); G02F 1/01 (2006.01); G02F 1/025 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12002 (2013.01); G02B 6/29338 (2013.01); G02B 6/29395 (2013.01); G02F 1/0147 (2013.01); G02F 1/025 (2013.01); G02B 2006/12069 (2013.01);
Abstract

The present disclosure relates to semiconductor structures and, more particularly, to optical via connections in chip-to-chip transmission in a 3D chip stack structure using an optical via, and methods of manufacture. The structure has a first wafer, including a first waveguide coupled to an optical resonator in the first wafer, and a second wafer, including a second waveguide, located over the first wafer. The structure also includes an optical via extending between the optical resonator of the first wafer and the second waveguide of the second wafer to optically couple the first and second waveguides.


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