The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Nov. 28, 2014
Applicant:
Namics Corporation, Niigata, JP;
Inventors:
Tomoya Yamazawa, Niigata, JP;
Kazuyuki Kohara, Niigata, JP;
Kodai Okoshi, Niigata, JP;
Nobuyuki Abe, Niigata, JP;
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/40 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); C08G 59/24 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08G 59/62 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/24 (2013.01); C08G 59/245 (2013.01); C08G 59/40 (2013.01); C08G 59/42 (2013.01); C08G 59/50 (2013.01); C08G 59/5033 (2013.01); C08G 59/621 (2013.01); H01L 23/29 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 23/3142 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08L 2203/206 (2013.01); H01L 21/563 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1312 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13157 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 2 μm or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.