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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10196513 B1

PDFFull Text
Date of Patent:
Feb. 05, 2019

Filed:

Nov. 28, 2014

Epoxy resin composition, semiconductor sealing agent, and semiconductor device

Applicant:

Namics Corporation, Niigata, JP;

Inventors:

Tomoya Yamazawa, Niigata, JP;

Kazuyuki Kohara, Niigata, JP;

Kodai Okoshi, Niigata, JP;

Nobuyuki Abe, Niigata, JP;

Assignee:

NAMICS CORPORATION, Niigata, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/40 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); C08G 59/24 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08G 59/62 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/24 (2013.01); C08G 59/245 (2013.01); C08G 59/40 (2013.01); C08G 59/42 (2013.01); C08G 59/50 (2013.01); C08G 59/5033 (2013.01); C08G 59/621 (2013.01); H01L 23/29 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 23/3142 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08L 2203/206 (2013.01); H01L 21/563 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1312 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13157 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 2 μm or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.

Find Patent Forward Citations

Yamazawa, Tomoya. (2019). Epoxy resin composition, semiconductor sealing agent, and semiconductor device (U.S. Patent No. 10196513). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10196513

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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