The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Oct. 15, 2015
Applicant:

Fujimi Incorporated, Kiyosu-shi, Aichi, JP;

Inventors:

Shuhei Takahashi, Aichi, JP;

Masatoshi Tomatsu, Aichi, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09G 1/18 (2006.01); B24B 37/00 (2012.01); C09K 3/14 (2006.01); H01L 21/304 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/18 (2013.01); B24B 37/00 (2013.01); C09G 1/02 (2013.01); C09K 3/14 (2013.01); C09K 3/1436 (2013.01); C09K 3/1463 (2013.01); H01L 21/304 (2013.01); H01L 21/321 (2013.01);
Abstract

Provided is a polishing composition capable of keeping a good polishing removal rate stably. The polishing composition includes silica particles as abrasives and a basic compound as a polishing removal accelerator. The silica particles have a density of silanol groups that is 1.5 to 6.0 pieces/nm. The polishing composition has an adsorption ratio parameter A that is 1.2 or less, the adsorption ratio parameter representing concentration dependency of an amount of adsorption of the basic compound to the silica particles as the ratio of high-concentration adsorption amount/low-concentration adsorption amount.


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