The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Mar. 17, 2015
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Ken Takano, Kitaadachi-gun, JP;
Naoya Saiki, Koshigaya, JP;
Assignee:
Lintec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 133/06 (2006.01); C09J 11/06 (2006.01); C09J 133/06 (2006.01); C09D 7/63 (2018.01); H01L 21/02 (2006.01); H01L 21/78 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08K 5/548 (2006.01);
U.S. Cl.
CPC ...
C09D 133/068 (2013.01); C09D 7/63 (2018.01); C09J 11/06 (2013.01); C09J 133/068 (2013.01); H01L 21/022 (2013.01); H01L 21/78 (2013.01); H01L 23/295 (2013.01); H01L 23/3157 (2013.01); C08K 5/548 (2013.01);
Abstract
A protective film-forming film is provided for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. This protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.