The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Oct. 01, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventor:

Lei Feng, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 5/12 (2006.01); H03F 3/21 (2006.01); H03F 3/24 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01P 11/00 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H01P 5/12 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/245 (2013.01); H01F 2027/2809 (2013.01); H01P 11/007 (2013.01); H03F 2200/451 (2013.01); H03F 2200/537 (2013.01); H03F 2200/541 (2013.01);
Abstract

Embodiments are generally directed to a transformer based on-package power combiner. An embodiment of a power combiner includes multiple primary coils on a first metal layer of a package; a secondary coil on a second metal layer of the package, the secondary coil including multiple secondary coil portions, wherein each primary coil is located to be aligned with a respective one of the secondary coil portions; a trace on a third metal layer of the package; and multiple vias to connect the secondary coil portions to the trace on the third metal layer.


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Feng, Lei. (2019). Transformer based on-package power combiner (U.S. Patent No. 10186747). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10186747

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