The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Sep. 04, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Steven Bentley, Watervliet, NY (US);

Richard A. Farrell, Albany, NY (US);

Gerard Schmid, Rensselaer, NY (US);

Ajey Poovannummoottil Jacob, Watervliet, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 21/3105 (2006.01); H01L 21/308 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01L 29/66 (2006.01); H01L 29/775 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0676 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); H01L 21/3086 (2013.01); H01L 21/31144 (2013.01); H01L 29/068 (2013.01); H01L 29/0649 (2013.01); H01L 29/66439 (2013.01); H01L 29/66469 (2013.01); H01L 29/775 (2013.01); H01L 29/7851 (2013.01); H01L 29/7854 (2013.01);
Abstract

A method includes forming a first directed self-assembly material above a substrate. The substrate is patterned using the first directed self-assembly material to define at least one fin in the semiconductor substrate. A second directed self-assembly material is formed above the at least one fin to expose a top surface of the at least one fin. A substantially vertical nanowire is formed on the top surface of the at least one fin. At least a first dimension of the vertical nanowire is defined by an intrinsic pitch of the first directed self-assembly material and a second dimension of the vertical nanowire is defined by an intrinsic pitch of the second directed self-assembly material.


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