The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2019
Filed:
May. 30, 2017
Applicant:
X-fab Semiconductor Foundries Ag, Erfurt, DE;
Inventor:
Ralf Lerner, Erfurt, DE;
Assignee:
X-FAB SEMICONDUCTOR FOUNDRIES GMBH, Erfurt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 25/18 (2006.01); H01L 23/538 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/367 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/6835 (2013.01); H01L 23/367 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 25/50 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/82005 (2013.01);
Abstract
A component to be transferred to a receiving substrate is to be coupled both electrically and thermally. This is achieved by an integrated circuit comprising a substrate and a plurality of first components formed in or on the substrate. A plurality of metallization layers are provided. A second component applied by transfer printing is provided which is positioned, at least in part, on a level with and laterally adjacent to at least one of the plurality of metallization layers.