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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10186467 B1

PDFFull Text
Date of Patent:
Jan. 22, 2019

Filed:

Jul. 13, 2017

Semiconductor package device and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Bernd Karl Appelt, Kaohsiung, TW;

Kay Stefan Essig, Kaohsiung, TW;

Chi-Tsung Chiu, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Primary Examiner:

David Vu

Assistant Examiner:

Brandon Fox

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/76805 (2013.01); H01L 21/76879 (2013.01); H01L 23/3128 (2013.01); H01L 23/3142 (2013.01); H01L 23/3157 (2013.01); H01L 23/367 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 23/145 (2013.01); H01L 23/3677 (2013.01); H01L 2224/211 (2013.01); H01L 2224/215 (2013.01); H01L 2224/32146 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01);
Abstract

A semiconductor package device includes a first die, an adhesive layer, and an encapsulant layer. The first die comprises a first electrode at a first surface of the first die and a second electrode at a second surface of the first die opposite to the first surface of the first die. The adhesive layer is disposed on the first surface of the first die. The encapsulant layer encapsulates the first die and the adhesive layer, wherein substantially an entire surface of the second electrode is exposed from the encapsulant layer.

Find Patent Forward Citations

Appelt, Bernd. (2019). Semiconductor package device and method of manufacturing the same (U.S. Patent No. 10186467). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10186467

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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