The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2019
Filed:
Apr. 30, 2015
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Jun Zeng, Sunnyvale, CA (US);
Ana Del Angel, Guadalajara, MX;
Scott White, Barcelona, ES;
Sebastia Cortes I Herms, Barcelona, ES;
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/10 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/00 (2015.01); B33Y 50/02 (2015.01); G06T 1/20 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06T 7/10 (2017.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/00 (2014.12); B33Y 50/02 (2014.12); G06F 17/50 (2013.01); G06T 1/20 (2013.01);
Abstract
In an example, three-dimensional (3D) models of objects are combined for additive manufacturing. Two-dimensional (2D) slices are determined for each 3D model. If the 2D slices are determined to be complete, the 2D slices are combined according to a Boolean operation to generate combined 2D slices printable by an additive manufacturing system.