The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Sep. 04, 2015
Applicant:

Research & Business Foundation Sungkyunkwan University, Suwon-si, KR;

Inventors:

Dong Geun Jung, Seoul, KR;

Yong Ki Cho, Ansan-si, KR;

Won Jin Ban, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/50 (2006.01); C23C 16/503 (2006.01); C23C 16/52 (2006.01); A61F 2/82 (2013.01); C23C 16/02 (2006.01); C23C 16/04 (2006.01); H05H 1/24 (2006.01); G01R 31/12 (2006.01);
U.S. Cl.
CPC ...
C23C 16/503 (2013.01); A61F 2/82 (2013.01); C23C 16/0245 (2013.01); C23C 16/045 (2013.01); C23C 16/52 (2013.01); H05H 1/2406 (2013.01); A61F 2240/001 (2013.01); G01R 31/1263 (2013.01); H05H 2001/2412 (2013.01); H05H 2001/2456 (2013.01); H05H 2001/2462 (2013.01);
Abstract

The present invention relates to a method for checking a discharge inception voltage of a dielectric material, a method for forming a displacement field on the dielectric materials comprising applying a voltage the same as or higher than the discharge inception voltage generated by an external field obtained from the above to the dielectric material to which electrodes are connected, a method for forming plasma on the surfaces of the dielectric material comprising injecting reaction gases and applying a voltage the same as or higher than the discharge inception voltage obtained above to the dielectric material to which electrodes are connected, a method for forming a displacement field on the entire surface of the dielectric material comprising applying a voltage the same as or higher than the discharge inception voltage obtained above to the dielectric material to which electrodes are connected, and a dielectric material which is modified, in which the surfaces thereof are treated with plasma by the methods described above.


Find Patent Forward Citations

Jung, Dong. (2019). Method for generating plasma uniformly on dielectric material (U.S. Patent No. 10184181). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10184181

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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