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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10184179 B1

PDFFull Text
Date of Patent:
Jan. 22, 2019

Filed:

Jan. 20, 2015

Atomic layer deposition processing chamber permitting low-pressure tool replacement

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Shinichi Kurita, San Jose, CA (US);

Jozef Kudela, Morgan Hill, CA (US);

John M. White, Hayward, CA (US);

Dieter Haas, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:

Patterson & Sheridan, LLP

Primary Examiner:

Joseph A Miller, Jr

Int. Cl.
CPC ...
C23C 16/455 (2006.01); H01L 51/56 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01); C23C 16/04 (2006.01); C23C 16/44 (2006.01); C23C 16/54 (2006.01); H01J 37/32 (2006.01); H01L 51/52 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45548 (2013.01); C23C 16/042 (2013.01); C23C 16/4402 (2013.01); C23C 16/54 (2013.01); H01J 37/3244 (2013.01); H01J 37/32467 (2013.01); H01J 37/32513 (2013.01); H01J 37/32715 (2013.01); H01J 37/32834 (2013.01); H01J 37/32853 (2013.01); H01L 21/6719 (2013.01); H01L 21/67748 (2013.01); H01L 21/67751 (2013.01); H01L 21/68742 (2013.01); H01L 51/5237 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01J 37/32082 (2013.01); H01J 37/32899 (2013.01); H01J 2237/327 (2013.01); H01J 2237/3321 (2013.01); H01L 51/0011 (2013.01);
Abstract

The present disclosure relates to methods and apparatus for an atomic layer deposition (ALD) processing chamber for device fabrication and methods for replacing a gas distribution plate and mask of the same. The ALD processing chamber has a slit valve configured to allow removal and replacement of a gas distribution plate and mask. The ALD processing chamber may also have actuators operable to move the gas distribution plate to and from a process position and a substrate support assembly operable to move the mask to and from a process position.

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