The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2019
Filed:
Jun. 24, 2016
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventors:
Seiichi Hitomi, Haibara-gun, JP;
Takashi Kawashima, Haibara-gun, JP;
Kouitsu Sasaki, Haibara-gun, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01G 3/00 (2006.01); C01B 25/00 (2006.01); C09D 5/32 (2006.01); C01B 21/082 (2006.01); C08L 63/00 (2006.01); G02B 5/22 (2006.01); H01L 27/14 (2006.01); G02B 5/20 (2006.01); C08K 5/00 (2006.01); C09D 163/04 (2006.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01); C09D 7/63 (2018.01);
U.S. Cl.
CPC ...
C09D 5/32 (2013.01); C01B 21/082 (2013.01); C01B 25/00 (2013.01); C01G 3/006 (2013.01); C08K 5/0091 (2013.01); C08L 63/00 (2013.01); C09D 7/63 (2018.01); C09D 163/04 (2013.01); G02B 5/208 (2013.01); G02B 5/22 (2013.01); G02B 5/223 (2013.01); H01L 27/14 (2013.01); H01L 27/1462 (2013.01); H01L 27/14685 (2013.01); H04N 5/2257 (2013.01);
Abstract
An object of the present invention is to provide a near infrared radiation-absorbing composition having favorable shielding properties in a near infrared range when used to produce cured films, a near infrared radiation cut-off filter and a production method therefor, and a camera module and a production method therefor. The near infrared radiation-absorbing composition including a copper complex formed by reacting a compound (A) having two or more coordinating atoms that form bonds using unshared electron pairs with a copper component.